SPI(Solder Paste Inspection)

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PMP(Phase Measuring Profilometry) Profiling Images
Pemtron's color 3D solder paste inspection (3D SPI) device uses the latest color algorithm to produce images like the actual PCB.
Our 3D solder paste inspection (3D SPI) device allows for great convenience and accuracy for our customers.
Existing 3D image expresses the height as a color map.
However, the color 3D solder paste inspection (3D SPI) connects 2D colored images with 3D measuring data to provide detailed and accurate 3D color images, making the operation of equipment much easier.
3D Solder Paste Inspection(3D Color SPI) System Color Image Processing 12um, 18um & 20um Resolution accomodates M,L & XL PCB Sizes.
TROI 3300 is 2D/3D color Solder Paste Inspection (Color 3D SPI) System.